AKAHOSHI, Haruo: search on Z-Library

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1

Effects of Minor Elements in Cu Leadframe on Whisker Initiation From Electrodeposited Sn/Cu Coating

Kato, Takahiko, Akahoshi, Haruo, Nakamura, Masato, Hashimoto, Tomoaki, Nishimura, Asao

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2007

Language:

english

File:

PDF, 2.24 MB

english, 2007

2

Efficient oxidative coupling polymerization for synthesis of thermosetting poly(phenylene ether) copolymer with a low dielectric loss

Jun Nunoshige, Haruo Akahoshi, Yuji Shibasaki, Mitsuru Ueda

Journal:

Journal of Polymer Science Part A: Polymer Chemistry

Year:

2008

Language:

english

File:

PDF, 135 KB

english, 2008

3

The embrittlement mechanism and improvement of impact strength for lead-free solder joints in BGA packaging using electrolytic Ni/Au plating

Yamamoto, Kenichi, Kato, Takahiko, Kawamura, Toshinori, Nakano, Hiroshi, Koizumi, Masahiro, Akahoshi, Haruo, Satoh, Ryohei

Journal:

Welding International

Year:

2009

Language:

english

File:

PDF, 1014 KB

english, 2009

4

An Embrittlement Mechanism of Impact Fracture of Sn–Ag–Cu Solder Joints on BGA Using Electroplated Ni/Au Surface Finishes

Yamamoto, Kenichi, Akahoshi, Haruo, Kato, Takahiko, Kawamura, Toshinori, Koizumi, Masahiro, Satoh, Ryohei

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2008

Language:

english

File:

PDF, 2.43 MB

english, 2008

5

Development of Formaldehyde Free Electroless Copper Plating Solution.

ITABASHI, Takeyuki, AKAHOSHI, Haruo, IIDA, Tadashi, TAKAI, Eiji, NISHIMURA, Naoki

Journal:

Journal of Japan Institute of Electronics Packaging

Year:

2002

Language:

english

File:

PDF, 828 KB

english, 2002

6

Selective and Anisotropic Copper Electroplating Using Copper Overburden with an Inhibiting Additive

Haba, Toshio, Suzuki, Hitoshi, Yoshida, Hiroshi, Akahoshi, Haruo, Chinda, Akira

Journal:

Electrochemical and Solid-State Letters

Year:

2010

Language:

english

File:

PDF, 427 KB

english, 2010

7

Mechanism of Nodule Formation in Electroless Copper Deposition.

ITABASHI, Takeyuki, AKAHOSHI, Haruo, TAKAHASHI, Akio

Journal:

Circuit Technology

Year:

1994

File:

PDF, 7.70 MB

1994

8

Furan fatty acid as an anti-inflammatory component from the green-lipped mussel Perna canaliculus

Toshiyuki Wakimoto, Hikaru Kondo, Hirohiko Nii, Kaori Kimura, Yoko Egami, Yusuke Oka, Masae Yoshlda, Eri Kida, Yiping Ye, Saeko Akahoshi, Tomohiro Asakawa, Koichi Matsumura, Hitoshi Ishida, Haruo Nuka

Journal:

Proceedings of the National Academy of Sciences

Year:

2011

Language:

english

File:

PDF, 1024 KB

english, 2011

9

Impedance of a reaction involving two adsorbed intermediates: aluminum dissolution in non-aqueous lithium imide solutions

László Péter, Juichi Arai, Haruo Akahoshi

Journal:

Journal of Electroanalytical Chemistry

Year:

2000

Language:

english

File:

PDF, 219 KB

english, 2000

10

Effect of Ni Plating Condition on Lead-Free Solder Joints Reliability of BGA Using Electroplated Ni/Au under Impact Load

YAMAMOTO, Kenichi, AKAHOSHI, Haruo, KATO, Takahiko, KAWAMURA, Toshinori, KOIZUMI, Masahiro, KIMOTO, Ryosuke, SATOH, Ryohei

Journal:

Journal of Japan Institute of Electronics Packaging

Year:

2007

File:

PDF, 13.59 MB

2007

11

Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects

Khoo, Khyoupin, Onuki, Jin, Nagano, Takahiro, Chonan, Yasunori, Akahoshi, Haruo, Tobita, Toshimi, Chiba, Masahiro, Saito, Tatsuyuki, Ishikawa, Kensuke

Journal:

Japanese Journal of Applied Physics

Year:

2006

Language:

english

File:

PDF, 255 KB

english, 2006

12

Effect of the Purity of Plating Materials on the Reduction of Resistivity of Cu wires for Future LSIs

Onuki, Jin, Tashiro, Suguru, Khoo, Khyoupin, Ishikawa, Nobuhiro, Kimura, Takashi, Chonan, Yasunori, Akahoshi, Haruo

Journal:

Journal of The Electrochemical Society

Year:

2010

Language:

english

File:

PDF, 1.20 MB

english, 2010

13

Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction

Khoo, Khyoupin, Onuki, Jin, Nagano, Takahiro, Tashiro, Suguru, Chonan, Yasunori, Akahoshi, Haruo, Haba, Toshio, Tobita, Toshimi, Chiba, Masahiro, Ishikawa, Kensuke

Journal:

MATERIALS TRANSACTIONS

Year:

2007

Language:

english

File:

PDF, 207 KB

english, 2007

14

Mechanism fot the Deposition of Electroless Nickel Films on Copper with No Catalyzer.

SUZUKI, Yoshihiro, TAKAHASHI, Akio, AKAHOSHI, Haruo, WAJIMA, Motoyo, NARAHARA, Toshikazu

Journal:

Journal of The Surface Finishing Society of Japan

Year:

1993

File:

PDF, 1.36 MB

1993

15

Filling 80-nm-Wide and High-Aspect-Ratio Trench with Pulse Wave Copper Electroplating and Observation of the Microstructure

Chonan, Yasunori, Onuki, Jin, Nagano, Takahiro, Khoo, Khyoupin, Aoyama, Takashi, Akahoshi, Haruo, Haba, Toshio, Saito, Tatsuyuki

Journal:

Japanese Journal of Applied Physics

Year:

2006

Language:

english

File:

PDF, 238 KB

english, 2006

16

Localization of Precise Origin of Idiopathic Ventricular Tachycardia from the Right Ventricular Outflow Tract by a 12-Lead ECG: A Study of Pace Mapping Using a Multielectrode “Basket” Catheter

YUKIHIKO YOSHIDA, MAKOTO HIRAI, YOSHIMASA MURAKAMI, TAKAHISA KONDO, YASUYA INDEN, MAKOTO AKAHOSHI, MAKOTO TSUDA, MITSUHIRO OKAMOTO, TAKUMI YAMADA, NAOYA TSUBOI, HARUO HIRAYAMA, TERUO ITO, JUNJI TOYAMA

Journal:

Pacing and Clinical Electrophysiology

Year:

1999

Language:

english

File:

PDF, 3.53 MB

english, 1999

17

Solvation states and properties of binary mixtures of halogenated cyclic carbonates and a linear carbonate

Hideaki Katayama, Juichi Arai, Haruo Akahoshi

Journal:

Journal of Power Sources

Year:

1999

Language:

english

File:

PDF, 174 KB

english, 1999

18

Newly Developed Abrasive-free Copper CMP Slurry Based on Electrochemical Analysis

Amanokura, Jin, Mabuchi, Katsumi, Sakurada, Takafumi, Nomura, Yutaka, Habiro, Masanobu, Akahoshi, Haruo

Journal:

MRS Proceedings

Year:

2007

Language:

english

File:

PDF, 1.30 MB

english, 2007

19

Plasma polymerization of hexafluoroethane.

TAKADA, Toshinari, AKAHOSHI, Haruo, TAKAHASHI, Akio

Journal:

KOBUNSHI RONBUNSHU

Year:

1990

File:

PDF, 711 KB

1990

20

10.2320/materia.43.3

Onuki, Jin, Nagano, Takahiro, Koide, Yasuo, Nakatani, Ryoichi, Akahoshi, Haruo

Journal:

Year:

2004

File:

PDF, 1.91 MB

2004

21

[IEEE 2007 IEEE International Interconnect Technology Conferencee - Burlingame, CA, USA (2007.06.4-2007.06.6)] 2007 IEEE International Interconnect Technology Conferencee - The Development of an Innovative Process of Large Grained and Low Resistivity Cu Wires for less than hp 45nm ULSI

Tashiro, Suguru, Khoo, Khyoupin, Nagano, Takahiro, Onuki, Jin, Chonan, Yasunori, Akahoshi, Haruo, Tobita, Toshimi, Chiba, Masahiro, Ishikawa, Kensuke, Ishikawa, Nobuhiro

Year:

2007

Language:

english

File:

PDF, 444 KB

english, 2007

22

Materials-Related Issues for Cu Interconnects Used in Ultra High Speed Large Scaled Integrated Si Devices. Electrochemical and Simulative Studies of Trench Filling Mechanisms in the Copper Damascene Electroplating Process.

Haba, Toshio, Itabashi, Takeyuki, Akahoshi, Haruo, Sano, Akihiro, Kobayashi, Kinya, Miyazaki, Hiroshi

Journal:

MATERIALS TRANSACTIONS

Year:

2002

Language:

english

File:

PDF, 213 KB

english, 2002

23

Electrochemical and spectroelectrochemical properties of polyviologen complex modified electrodes

Akahoshi, Haruo, Toshima, Shinobu, Itaya, Kingo

Journal:

Journal of Physical Chemistry

Year:

1981

Language:

english

File:

PDF, 597 KB

english, 1981

24

10.2320/materia.43.28

Kohinata, Shigeru, Fujita, Eiichi, Akahoshi, Haruo, Onuki, Jin

Journal:

Year:

2004

File:

PDF, 4.51 MB

2004

25

Low Dielectric Loss Copolymer Obtained from 2,6-Dimethylphenol and 2-Allyl-6-methylphenol via Cu-catalyzed Oxidative Coupling Polymerization

Nunoshige, Jun, Akahoshi, Haruo, Shibasaki, Yuji, Ueda, Mitsuru

Journal:

Chemistry Letters

Year:

2007

Language:

english

File:

PDF, 74 KB

english, 2007

26

Endoscopic submucosal dissection by using a grasping-type scissors forceps: a preliminary clinical study (with video)

Kazuya Akahoshi, Kuniomi Honda, Hidefumi Akahane, Haruo Akiba, Noriaki Matsui, Yasuaki Motomura, Masaru Kubokawa, Shingo Endo, Naomi Higuchi, Masafumi Oya

Journal:

Gastrointestinal Endoscopy

Year:

2008

Language:

english

File:

PDF, 914 KB

english, 2008

27

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Advanced trench filling process by selective copper electrodeposition for ultra fine printed wiring board fabrication

Nakano, Hiroshi, Suzuki, Hitoshi, Haba, Toshio, Yoshida, Hiroshi, Chinda, Akira, Akahoshi, Haruo

Year:

2010

Language:

english

File:

PDF, 1.04 MB

english, 2010

28

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Stress measurement by X-Ray diffraction method for electrodeposited SnCu coating on alloy 42 substrate

Takahiko Kato,, Haruo Akahoshi,, Masato Nakamura,, Tomoaki Hashimoto,, Asao Nishimura,

Year:

2008

Language:

english

File:

PDF, 648 KB

english, 2008

29

Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating

Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Nagano, Takahiro, Akahoshi, Haruo, Itabashi, Takeyuki, Saito, Tatuyuki, Khoo, Khyoupin

Journal:

MATERIALS TRANSACTIONS

Year:

2006

Language:

english

File:

PDF, 102 KB

english, 2006

30

Reaction-induced phase decomposition of thermoset/thermoplastic blends investigated by energy filtering transmission electron microscopy

Yonggui Liao, Shin Horiuchi, Jun Nunoshige, Haruo Akahoshi, Mitsuru Ueda

Journal:

Year:

2007

Language:

english

File:

PDF, 3.30 MB

english, 2007

31

Binary Mixed Solvent Electrolytes Containing Trifluoropropylene Carbonate for Lithium Secondary Batteries

Arai, Juichi, Katayama, Hideaki, Akahoshi, Haruo

Journal:

Journal of The Electrochemical Society

Year:

2002

Language:

english

File:

PDF, 380 KB

english, 2002

32

Influence of Grain Size Distributions on the Resistivity of 80 nm Wide Cu Interconnects

Khoo, Khyoupin, Onuki, Jin, Nagano, Takahiro, Chonan, Yasunori, Akahoshi, Haruo, Tobita, Toshimi, Chiba, Masahiro, Saito, Tatsuyuki, Ishikawa, Kensuke

Journal:

MATERIALS TRANSACTIONS

Year:

2007

Language:

english

File:

PDF, 218 KB

english, 2007

33

Glass-modified stress waves for adhesion measurement of ultra thin films for device applications

Vijay Gupta, Vassili Kireev, Jun Tian, Hiroshi Yoshida, Haruo Akahoshi

Journal:

Journal of the Mechanics and Physics of Solids

Year:

2003

Language:

english

File:

PDF, 737 KB

english, 2003

34

Mechanical and Dielectric Properties of a New Polymer Blend Composed of 1,2-Bis(vinylphenyl)ethane and Thermosetting Poly(phenylene ether) Copolymer Obtained from 2,6-Dimethylphenol and 2-Allyl-6-methylphenol

Nunoshige, Jun, Akahoshi, Haruo, Liao, Yonggui, Horiuchi, Shin, Shibasaki, Yuji, Ueda, Mitsuru

Journal:

Polymer Journal

Year:

2007

Language:

english

File:

PDF, 269 KB

english, 2007

35

Whisker Initiation Behavior from Electrodeposited Sn/Cu Coating on Cu Leadframe

Kato, Takahiko, Akahoshi, Haruo, Terasaki, Takeshi, Iwasaki, Tomio, Nakamura, Masato, Hashimoto, Tomoaki, Nishimura, Asao

Journal:

Materials Science Forum

Year:

2007

Language:

english

File:

PDF, 782 KB

english, 2007

36

Adsorption of divalent cations on tin oxide electrodes in aqueous solutions

Isamu Uchida, Haruo Akahoshi, Shinobu Toshima

Journal:

Journal of Electroanalytical Chemistry and Interfacial Electrochemistry

Year:

1978

Language:

english

File:

PDF, 329 KB

english, 1978

37

Changes in Repolarization Properties with Long-Term Cardiac Memory Modify Dispersion of Repolarization in Patients with Wolff-Parkinson-White Syndrome

YASUNOBU TAKADA, YASUYA INDEN, MAKOTO AKAHOSHI, YOSHIHISA SHIBATA, ATSUYA SHIMIZU, YUKIHIKO YOSHIDA, TAKUMI YAMADA, NAOYA TSUBOI, HARUO HIRAYAMA, TERUO ITO, TAKAHISA KONDO, HIDEHIKO SAITO, MAKOTO HIRA

Journal:

Journal of Cardiovascular Electrophysiology

Year:

2002

Language:

english

File:

PDF, 236 KB

english, 2002

38

Aspect Ratio Dependence of the Resistivity of Fine Line Cu Interconnects

Khoo, Khyoupin, Onuki, Jin, Nagano, Takahiro, Chonan, Yasunori, Akahoshi, Haruo, Haba, Toshio, Tobita, Toshimi, Chiba, Masahiro, Ishikawa, Kensuke

Journal:

Japanese Journal of Applied Physics

Year:

2007

Language:

english

File:

PDF, 334 KB

english, 2007

39

10.4139/sfj.52.54

SANO, Akihiro, KOBAYASHI, Kinya, AKAHOSHI, Haruo, ITABASHI, Takeyuki, HABA, Toshio, FUKADA, Shinichi, MIYAZAKI, Hiroshi

Journal:

Journal of The Surface Finishing Society of Japan

Year:

2001

File:

PDF, 1.02 MB

2001

40

The Embrittlement Mechanism and Improvement of Impact Strength for Lead-Free Solder Joints in BGA Packages Using Electrolytic Ni/Au Plating

YAMAMOTO, Kenichi, KATO, Takahiko, KAWAMURA, Toshinori, NAKANO, Hiroshi, KOIZUMI, Masahiro, AKAHOSHI, Haruo, SATOH, Ryohei

Journal:

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY

Year:

2008

File:

PDF, 2.46 MB

2008

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